上下盖内绷环设计有效减少晶圆横向移动，同时确保不会压到晶圆边缘。

Upper lid and lower base match wafer flex frame design effectively reduces wafer lateral movement while ensuring that it does not press to wafer edges.

锁扣安全系统和内环抗冲击空间设计，给晶圆运输过程中提供有效保护。

Lock catch secure system and inner side impact resistant space design provide effective protection during wafer transportation.

优化产品设计的同时，又有效降低产品重量。

It can effectively reduce the overall weight while optimizing the product design.

设计符合制程设备自动接口。

The design conforms to the automatic interface of process equipment.

产品 Product	晶圆尺寸 Wafer Size	材料 Material	表面电阻 Surface Resistance
水平绷框盒 Horizontal Flex Frame	6"/150mm	防静电PP Antistatic PP	1.0×10-4-1.0×10-1 Ω 2.5×10-3 Ω
	12"/300mm

晶圆尺寸 Wafer Size	搭配方案 Collocation Reference	最大承载量 Maximum Capacity
6"/150mm	1、下底+防震泡棉+隔离纸+绷环+上盖 Bottom+Foam+Interleaf+Flex Frame+Top	25pcs
	2、下底+防震泡棉+导电隔离垫+绷环+上盖 Bottom+Foam+Isolating Pad+Flex Frame+Top
8"/200mm	2、下底+防震泡棉+导电隔离垫+绷环+上盖 Bottom+Foam+Isolating Pad+Flex Frame+Top	13 & 25pcs
12"/300mm	2、下底+防震泡棉+导电隔离垫+绷环+上盖 Bottom+Foam+Isolating Pad+Flex Frame+Top	13pcs