JEDEC 承载盘/IC 承载盘
设计符合 JEDEC 国际标准，通用性强。
Designs conforms JEDEC international standard, strong versatility.
承载盘装配槽多样灵活的设计，为不同芯片底层边缘焊球和引脚提供更好保护。
The flexible design of the Jedec tray provides better protection for chips with different bottom edges of the ball and pins.
优化产品设计，能为各种封装方式的 IC 提供更好保护同时降低运输成本。
Optimal product design, can provide a variety of packaging IC with protection and while reducing transportation costs.
各种系列的材料供客户选择，满足客户 ESD 及烘烤要求。
A variety of materials for customers to choose from to meet your ESD and baking requirements.
翘曲度小于0.76mm，支持非标准款式定制服务。
Warpage less than 0.76mm, support non-standard style customization service.
| 材料 Material |
烘烤温度 Bake Temp |
表面电阻值 Surface Resistance |
|---|---|---|
| MPPO+Carbon Fiber (碳纤) | 125°C/150°C Max | 1.0×10⁴~1.0×10¹¹ Ω |
| MPPO+Carbon Powder (碳黑) | ||
| MPPO+Glass Fiber (玻纤) | ||
| PES / PEI+Carbon Fiber (碳纤) | 180°C Max | |
| IDP (ESD聚合物+Color Option 可定制颜色) | 85°C |
其他更多尺寸或定制需求请联系我司相关人员，为您的产品提供一站式包装解决方案。
For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.